商品介绍
The CoolSiC™ Schottky diodes generation 5 600V, 2 A in a DPAK real2pin package represents our leading edge technology for SiC Schottky Barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3, is now combined with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit (Q c x V f ).
标准包装
标准包装是从制造商/代理商处获得的最小包装规格。所以最小订货量可能会小于制造商的标准包装的数量。当产品分解成较小数量时,包装类型(即卷、管、盘)可能会发生变化,以实际包装交货为准。