The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital gyroscope.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.

The LSM330 has a user-selectable full-scale acceleration range of ±2/±4/±6/±8/±16 g and an angular rate range of ±250/±500/±2000 dps. The accelerometer and gyroscope sensors can be either activated or separately put in power-down / sleep mode for applications optimized for power saving.

The LSM330 is available in a plastic land grid array (LGA) package.

lsm330这是包装具有三维数字加速度计与嵌入式状态机，可以通过编程实现自主应用和三维数字陀螺仪系统。

圣家族的MEMS传感器模块利用强大的和已经用于微机械加速度计和陀螺仪的生产制造工艺成熟。

各种传感元件是利用专门的微加工工艺制造，而IC接口使用CMOS技术允许一个专用电路，修整，以更好地匹配传感元件特性的设计开发。

有一个用户选择的lsm330全面提速范围±2 / 4 / 6 /±±±8 /±16 g和250 / 500 /±±±2000 DPS角速率范围。该加速度计和陀螺仪传感器可以被激活或单独提出的功率下降/睡眠模式为应用程序优化的节能。

在一个塑料的lsm330栅格阵列（LGA）封装是可用的。

Key Features

• Analog supply voltage: 2.4 V to 3.6 V

• Digital supply voltage IOs: 1.8 V

• Power-down and sleep modes

• 2 embedded programmable state machines

• 3 independent acceleration channels and 3 angular rate channels

• ±2/±4/±6/±8/±16 g selectable full scale

• ±250/±500/±2000 dps selectable full scale

• SPI/I²C serial interface

• Embedded temperature sensor

• Embedded FIFO

• ECOPACK^®RoHS and “Green” complian

主要特点

模拟电源电压：2.4伏至3.6伏

数字电源电压：1.8 V的iOS

掉电模式

2嵌入式可编程状态机

3个独立的加速通道和3个角速率通道

2 / 4 / 8 / 16 g可选择的全尺寸

±250 / 500 / 2000±±DPS可选全尺寸

SPI和I2C串行接口

嵌入式温度传感器

嵌入式FIFO

®Ecopack RoHS和“绿色”的不满