The LPS331AP is an ultra compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world.

The sensing element consists of a suspended membrane realized inside a single mono-silicon substrate. It is capable to detecting pressure and is manufactured using a dedicated process developed by ST, called VENSENS.

The VENSENS process allows to build a mono-silicon membrane above an air cavity with controlled gap and defined pressure. The membrane is very small compared to the traditionally built silicon micromachined membranes. Membrane breakage is prevented by an intrinsic mechanical stopper.

The IC interface is manufactured using a standard CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics.

The LPS331AP is available in a small holed cap land grid array (HCLGA) package and it is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.

lps331ap是一种超小型绝对压阻式压力传感器。它包括一个单片传感元件和一个集成电路接口能够从传感元件的信息，并提供一个数字信号到外部世界。

该传感元件由一个单一的单体硅衬底上实现的悬浮膜。它能够检测压力，使用专用的过程由ST开发制造，称为vensens。

的vensens过程允许建立一个单一的硅膜上方空气腔间隙和压力控制的定义。与传统的硅微机械膜相比，该膜是非常小的。防止膜破裂的内在机械塞。

IC接口采用标准的CMOS工艺，允许高层次的集成设计专用电路，修整，以更好地匹配传感元件特性制造。

在一个小的lps331ap孔帽栅格阵列是可用的（hclga）封装，这是保证工作在扩展温度范围从- 40°C + 85°C.包装孔允许外部压力达到传感元件。

Key Features

• 260 to 1260 mbar absolute pressure range

• High-resolution mode: 0.020 mbar RMS

• Low power consumption:

• Low resolution mode: 5.5 μA

• High resolution mode: 30 μA

• High overpressure capability: 20x full scale

• Embedded temperature compensation

• Embedded 24-bit ADC

• Selectable ODR from 1 Hz to 25 Hz

• SPI and I2C interfaces

• Supply voltage: 1.71 to 3.6 V

• High shock survivability: 10,000 g

• Small and thin package

• ECOPACK® lead-free compliant

主要特点

260到1260毫巴绝对压力范围

高分辨率模式：0.020 mbar RMS

低功耗：

低分辨模式：5.5

高分辨模式：30

高过压能力：20X全面

嵌入式温度补偿

嵌入式24位ADC

可选的ODR从1赫兹到25赫兹

SPI和I2C接口

电源电压：1.71至3.6伏

高冲击生存能力：10000克

小而薄的包装

®ECOPACK无铅兼容