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    LSM303AGR

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    超小型高性能电子罗盘3D加速度计和三维磁强计模块

     

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    产品信息

    The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.

    The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.

    The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.

    The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.

    The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.

    The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

    lsm303agr是包装具有三维线性加速度传感器和三维数字磁传感器的超低功耗高性能系统。

    lsm303agr具有±2g/±4G /±8g /±16G和±50高斯磁场动态范围线性加速度全尺度。

    lsm303agr包括I2C串行总线接口,支持标准、快速模式,快速模式加上高速(100千赫,400千赫,1兆赫,3.4兆赫和)和一个SPI串行接口标准。

    该系统可配置为产生一个中断信号的自由下落,运动检测和磁场检测。

    该磁性和加速度计块可以被启用或投入到电源关闭模式分别。

    在一个塑料的lsm303agr栅格阵列(LGA)封装提供并保证工作在扩展温度范围从- 40°C + 85°C.

    Key Features

    • 3 magnetic field channels and 3 acceleration channels

    • ±50 gauss magnetic dynamic range

    • ±2/±4/±8/±16 g selectable acceleration full scales

    • 16-bit data output

    • SPI / I2C serial interfaces

    • Analog supply voltage 1.71 V to 3.6 V

    • Power-down mode / low-power mode

    • Programmable interrupt generators for free-fall, motion detection and magnetic field detection

    • Embedded self test

    • Embedded temperature sensor

    • Embedded FIFO

    • ECOPACK®, RoHS and “Green” compliant

    主要特点

    3磁场通道和3加速通道

    ±50高斯磁场的动态范围

    2 / 4 / 16 / 8可选择加速度满刻度

    16位数据输出

    SPI和I2C串行接口

    模拟电源电压1.71伏至3.6伏

    掉电模式/低功耗模式

    可编程中断发生器的自由下落,运动检测和磁场检测

    嵌入式自测试

    嵌入式温度传感器

    嵌入式FIFO

    ®Ecopack,ROHS和“绿色”标准


    电路图、引脚图和封装图

    技术资料

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